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      Nikon NEXIV VMZ-K3040

      NEXIV VMZ-K3040 – Ground-breaking multi-functional confocal video measuring system

      A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.

      • Combines confocal optics and brightfield optics, for fast and accurate evaluation of fine threedimensional geometries
      • Allows both 2D and height measurements in the same field of view.

      This series can be optimally used for inspecting precise 3D-shaped samples, including micro bumps, circuit patterns, and bonding wires, as well as samples with countless points, such as probe cards.

      The VMZ-K series can also measure both the shallow recesses and gentle ledges on PCBs.

      Main Features

      General model for a wide range of needs.

      Main Applications

      • Microscopic bumps in advanced IC packages
      • Probe cards
      • Precision optical components
      • Microscopic laser marks on semiconductor wafers
      • MEMS
      • Wire bonding.

      Examples

      Download the brochure

      Description

      NEXIV VMZ-K3040 – Ground-breaking multi-functional confocal video measuring system

      A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology.

      • Combines confocal optics and brightfield optics, for fast and accurate evaluation of fine threedimensional geometries
      • Allows both 2D and height measurements in the same field of view.

      This series can be optimally used for inspecting precise 3D-shaped samples, including micro bumps, circuit patterns, and bonding wires, as well as samples with countless points, such as probe cards.

      The VMZ-K series can also measure both the shallow recesses and gentle ledges on PCBs.

      Main Features

      General model for a wide range of needs.

      Main Applications

      • Microscopic bumps in advanced IC packages
      • Probe cards
      • Precision optical components
      • Microscopic laser marks on semiconductor wafers
      • MEMS
      • Wire bonding.

      Examples

      View more See less

      Do you have more questions?

      You can request an offer

      Nikon NEXIV VMZ-K3040

      Request offer

      Funding

      Financing solutions for the purchase of new equipment, through BCR Leasing or Grenke.

      See Financing Methods

      Specifications

      Stroke (X, Y, Z)

      300 x 400 x 150 mm

      Loading capacity

      20 kg

      Illumination

      Diascopic, coaxial episcopic and ring.

      See Product Catalog

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