Nikon NEXIV VMZ-K3040

NEXIV VMZ-K3040 – Ground-breaking multi-functional confocal video measuring system

It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system!
The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.

Key benefits

• Simultaneous wide-area height measurement with Nikon proprietary confocal optics
• 2D measurement with 15x brightfield zoom optics
• Fully compatible with 300 mm wafer measurement at semiconductor fabs
• General model for a wide range of needs

Applications

• IC Packages: Flip Chip/COF(Bump)/COG, CSP (FBGA)/SIP (Bump, Wire), Interposer (Pad height)
• MEMS
• Probe Card (Silicon Probe, Au Probe)
• Precise Glass Components (Micro Lens, Contact Lens)
• Photo Spacer Width/Height for Color Filter for FPD Panel

Examples